💡 In This Article The trade-offs that arise as thermal conductive filler loading increases Why understanding phonon scattering and interfacial thermal resistance matters in epoxy formulation How particle size distribution and interfacial properties can be optimized to improve thermal conductivity without sacrificing processability One request comes up from customers surprisingly often when developing an adhesive: … Continue reading High Thermal Conductivity Adhesives — Why Are They So Difficult to Formulate? →